零件编号 : LP8755
功能 : Multi-Phase 6-Core Step-Down Converter / 49-Bump 0.4 mm Pitch DSBGA Package
制造商 : Texas Instruments
引脚图 :
描述
The LP8755 is designed to meet the power management requirements of the latest applications processors in mobile phones and similar portable applications. The device contains six step-down DC/DC converter cores, which are bundled together in a 6-phase buck converter. The device is fully controlled by a SmartReflex™-compatible interface or an I2C-compatible serial interface.
数据手册 PDF资料下载
文件中的其他数据表：
LP8755,LP8755KME,LP8755KME/NOPB,LP8755KMX,LP8755KMX/NOPB